There have been a lot of rumors and sources hinting at the next iPhone 8’s impressive specs and new design, which could lead to confusion ranging from OLED display, iris scanning to A11 chip and new Touch ID.
According to the latest rumors, the next iPhone 8 will come with the stainless steel casing, rather than use traditional aluminum CNC machining. These rumors match with the previous reports claiming that Apple would move away from the aluminum used in the current iPhone 5, 5s, 6, 6s, and SE. The stainless steel chassis was once a fan-favorite, as it was first used with iPhone 4. According to sources, the cost of the forging process is much cheaper than the current aluminum body, while quality control remains the same, or even proves more stable.
Sources also say that Apple has added Wistron Corporation, a Taiwanese design manufacturer, as a new assembler for the next iPhone models in an attempt to keep up with the huge demand of the new iPhone. Wistron will be Apple’s third assembler for this year’s iPhone in addition to Apple’s long-terms partners Foxconn and Pegatron.
Apple has long been rumored to launch three iPhone models this year and at least one of the model will have a redesigned all-glass body and curved OLED display. Besides, there will be two standard 4.7 inch and 5.5 inch iPhone models this year. All the three models will come with long-range wireless charging, and biometric additions like iris or facial scanning.
Apart from iPhone 8, Apple is believed to launch three iPad models this spring. Accordingly, Apple may release an updated version of the current 12.9 inch iPad Pro, with the second one being an inexpensive 9.7 inch model that may replace the current iPad Air 2, while the existing 9.7 inch iPad Pro will be replaced by the new bezel-free model that will sport either 10 inch or 15 inch display.
Also read: iPhone 8 and what we know so far
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